Moldex3D Underfill Analysis
This software product can simulate capillary flow, which is influenced by the following:
- Surface tension of an encapsulant
- Contact angle among the encapsulant, bumps, and substrate of the dispensing process for flip-chip underfill
Underfill also allows you to input real dispensing procedures and predict the locations of voids in the underfill process to increase productivity.
Moldex3D Expert Analysis
Moldex3D Expert evaluates the appropriate settings of runner size, gate location, and optimal process conditions for injection molding part designs. This tool uses the design of experiments method to make the molding process more efficient and optimized.
